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TPU Hot-Melt Adhesive Film Compounds | Textile & Foam Lamination

Short Description:

TPU granules for hot-melt adhesive films used in textile/foam/leather lamination. Excellent bonding strength, wash resistance, soft handfeel, and stable flow for extrusion/casting film lines.


Product Detail

TPU Hot-Melt Adhesive Film (HMA) Compounds

For lamination and bonding projects where success depends on a stable balance of:
adhesion to real substrates, activation temperature window,
and post-aging durability (heat, humidity, flex, washing, chemical exposure).

Supply forms:
TPU HMA film compounds (pellets) for film extrusion/coating
Finished TPU hot-melt adhesive films (project-based, on request).
Most failures happen when initial tack is optimized but aging and process window are ignored.
Adhesion System
Activation Temp
Lamination Window
Flow Control
Wash / Aging Durability
Substrate Compatibility

Typical Applications

  • Textile & apparel lamination: fabric-to-fabric, fabric-to-membrane, logo/patch bonding.
  • Footwear: upper-to-lining, reinforcement layers, TPU-to-EVA/foam bonding (process-dependent).
  • Leather / synthetic leather bonding: decorative layers and structural laminations.
  • Industrial composites: film-laminate stacks where temperature window and aging retention matter.

Fast Selection (Choose the Dominant Constraint)

Low-Temp Activation

When substrates are heat-sensitive or line temperature is limited.

  • Lower activation temperature target
  • Broader lamination window
  • Minimize shrink / distortion risk

High Bond Strength

When peel/shear strength is primary (structural bonding).

  • Higher cohesive strength
  • Better shear resistance
  • Substrate-specific adhesion system

Aging / Wash Durability

When bonds must survive heat-humidity, washing, flex, and time.

  • Post-aging peel retention
  • Humidity/heat resistance route
  • Reduced delamination risk
If your project has two or more hard constraints (e.g., low-temp activation + high peel + wash durability),
it is an Advanced Functional case: formulation + process window must be tuned together.

Common Failure Modes (Cause → Fix)

In hot-melt film bonding, “it sticks at first” is easy. The real battle is stable bonding across
temperature window, pressure/time, and aging exposure.

Symptom Most Common Cause Fix Direction
Passes initial peel, then delaminates after aging Adhesion system not matched to substrate; cohesive strength too low; aging route missing Switch adhesion route; raise cohesive strength; validate with heat-humidity / wash cycles
Narrow activation window (unstable line) Flow/viscosity window too tight; activation temp too close to process limit Broaden activation window; tune melt flow; adjust film thickness & lamination conditions
Weak bond on one substrate only Surface energy mismatch; contamination / release agents; incorrect primer strategy Substrate-specific route; surface treatment/primer check; run quick surface diagnostics
Edge lifting / tunnel / wrinkles after lamination Shrink mismatch, cooling tension, uneven activation, or pressure distribution issues Process tuning (temp/pressure/time/cooling); adjust structure; stabilize winding conditions
Film flows too much (bleed-through / print distortion) Low melt strength at activation; over-temperature; thickness too high for structure Increase melt strength; reduce activation temp; optimize thickness and lamination pressure/time
Brittleness / cracking in cold or after time Formulation too stiff; low-temp package missing; aging route not matched Improve low-temp flexibility; adjust hard/soft segment balance; validate flex cycles

What We Need to Recommend a Shortlist

Bonding stack

  • Substrate A / Substrate B (material, coating, surface treatment)
  • Film thickness target (and tolerance)
  • Bond type (peel vs shear priority)

Process & validation

  • Lamination temperature range, pressure, dwell time
  • Cooling and tension/winding conditions
  • Aging plan: heat-humidity, washing cycles, chemicals, flex

Request Samples / TDS

We can support both pellets (for your film extrusion/coating) and finished films (project-based).
Share the key inputs below and we will recommend a shortlist and provide TDS/SDS for trials.

To get a fast recommendation, send:
  • Substrates: material + surface condition (treated / coated / release agents)
  • Bond requirement: peel/shear targets and operating temperature
  • Activation window: available lamination temperature range and dwell time
  • Aging plan: heat-humidity, wash cycles, chemicals, flexing (if any)
  • Supply form: pellets for film making, or finished adhesive film (thickness/width/roll)

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