Glass Fiber Reinforced PC Compound for Structural Parts
Product Description
Glass Fiber Reinforced PC Compound is designed for injection molding applications where higher stiffness, dimensional stability, heat resistance and improved mechanical strength are required.
If you are currently using SABIC LEXAN, Covestro Makrolon, Mitsubishi Iupilon, Teijin Panlite, LG Lupoy or similar glass fiber reinforced PC materials, Chemdo can help check suitable China-origin reinforced PC options for trial based on your current grade, TDS and application.
Typical Applications
Electrical housings
Industrial components
Automotive electrical parts
Precision molded parts
Mechanical brackets
Electronic equipment parts
Available Material Directions
| Material Direction | Main Value |
|---|---|
| PC GF10 | For applications requiring moderate stiffness improvement while keeping better processability. |
| PC GF20 | For molded parts requiring a stronger balance of stiffness, strength and dimensional stability. |
| PC GF30 | For structural parts requiring higher rigidity, heat resistance and mechanical strength. |
| FR Reinforced PC | For applications requiring both glass fiber reinforcement and flame retardancy. |
Final grade selection depends on current material, glass fiber content, stiffness requirement, flame rating, part design, processing method and trial result.
Why Chemdo
We help customers check China-origin options based on current SABIC, Covestro, Mitsubishi, Teijin, LG or similar reinforced PC grades.
We select materials according to glass fiber content, stiffness, heat resistance, dimensional stability, flame rating and processing condition.
We can support sample direction, TDS review and follow-up adjustment after injection molding trial feedback.
TDS, COA, SDS and basic compliance support can be provided according to project requirements.
How to Start
Send us your current grade name, TDS, glass fiber content or final part application. Chemdo will check a suitable China-origin reinforced PC option based on your stiffness requirement, heat resistance, processing method and trial target.
